Double-Sided Polyimide High-Temperature PCB for Telecom / IT
When your telecom or IT systems demand reliability in extreme environments, our double-sided polyimide PCBs rise to the occasion. Engineered to endure continuous operation at 250 °C, these circuit boards combine cutting-edge materials with precision manufacturing to deliver performance you can trust.
Why Choose Polyimide High-Temp PCBs?
Extreme Temperature Resilience
Survive where standard FR-4 fails. These circuit boards maintain stability and integrity in sustained 250 °C environments.
Precision Manufacturing
We adhere to tight dimensional tolerances and rigorous processing to ensure consistency and performance.
End-to-End Quality Control
From material selection to final inspection, every circuit board is validated to meet industry standards and your specifications.
Telecom & IT Focus
We’ve shipped over 1,000 such circuit boards for telecom/IT applications, backed by a track record of performance and client satisfaction.
Customizable Designs
While we list a nominal circuit board dimension of 10.5″ × 3″, every project can be modified to fit your exact layout and mechanical needs.
Project Summary
A major telecom client required 1,000 double-sided high-temperature boards. We manufactured them with the following:
- Polyimide laminate materia
- Tolerances held to ±0.005″
- Applied full spectrum of operations (metallization, etch, hot-air leveling, silkscreen)
- Delivered to the southwestern U.S. on schedule
- All units passed stringent standards (IPC-6012B, IPC-A-600, UL-94 V-1)
This project highlights our process control, reliability in harsh environments, and ability to scale while maintaining quality.
Key Features & Capabilities
| Feature | Details |
|---|---|
| Continuous Temp Rating | 250 °C |
| Layers | Double-sided |
| Material | Polyimide laminate (IPC 4101 / 41) |
| Tolerances | As tight as ±0.005″ |
| Typical Size | 10.5″ × 3″ (customizable per client specs) |
| Processing Steps | Shearing, CNC drilling & deburring, direct metallization, primary imaging, copper plating, etching, hot air solder leveling, silkscreen |
| Standards Compliance | IPC-6012B, IPC-A-600, UL-94 V-1 |
| Validation Methods | Visual inspection, in-process testing |